A research group organized by Associate Professor Jun Ishimoto and Professor Seiji Samukawa at Institute of Fluid Science, Tohoku University has developed a new cleaning technology for semiconductor wafers without the use of harmful substances.

 We have successfully replaced conventional two stage operation of semiconductor cleaning, which is composed of plasma irradiation and cleaning with harmful agents, with single stage operation. We developed the new semiconductor cleaning method making use of particulate solid nitrogen spray. Since this technique can prevent damage to the wiring from plasma irradiation in the cleaning process and it is available for cleaning devices susceptible to oxygen radicals, this technology is focused as eco-friendly semiconductor cleaning technology.

More information (Japanese)

[Contact]

Associate Professor Jun Ishimoto

Reality-Coupled Computation Laboratory,

Transdisciplinary Fluid Integration Research Center

Institute of Fluid Science, Tohoku University

TEL: +81-22-217-5271

E-mail: ishimotojun*ieee.org (Replace * with @)

URL: http://alba.ifs.tohoku.ac.jp/