On November 10, 2011, the "5th Stanford and Tohoku Universities Joint Open Workshop on 3D Transistor and its Applications," which discusses 3D devices for next generation integrated circuit technology, was held at the Tohoku University Tokyo Branch. This workshop was co-chaired by Professor Endoh of Center for Interdisciplinary Research (CIR), Tohoku University and Professor Nishi of Center for Integrated Systems (CIS), Stanford University.

The workshop is aimed to further advance the collaborative research activity on the advanced 3D semiconductor integrated circuit technology between Professor Endoh of Tohoku University and Professor Nishi of Stanford University. The scope of this workshop was 3D-Devices, 3D Integrated Circuit (IC) Technology, Material and Process Technology for 3D-IC Technology, and 3D Interconnect Technology etc. Furthermore, the long year collaborative research, including this workshop, between Professor Endoh and Professor Nishi has resulted in a reciprocal department agreement between CIR of Tohoku University and CIS of Stanford University in April 2009.

This time, six internationally distinguished researchers of 3D integrated technology like FinFET, BiCS, memory cell stack and Cu metallization were invited as speakers, as well as over 130 participants who attended the workshop. Each speaker presented hot and cutting edge topics on 3D integrated technology and lively discussions took place between the participants. This year again, the 5th annual workshop finished with great success.

This workshop was a part of the Interdisciplinary Research for International Collaborative Research from CIR, Tohoku University.

	Invited Speakers
Opening Remarks by Professor Endoh of Tohoku University	Workshop Floor (Tohoku University Tokyo Branch)

Inquiry :
Endoh Lab, Center for Interdisciplinary Research
TEL 81-22-795-5260