2012 | Press Release
Standby-Power-Free Large-Scale Integrated Circuits using Nonvolatile Spintronics Devices - Now with high speed, density, and reliability -
A research group of Professor Hideo Ohno of Center for Spintronics Integrated Systems and Research Institute of Electrical Communication of Tohoku University together with NEC Corporation (NEC) developed a standby-power-free spintronics-based large-scale integrated circuit (LSI) using a nonvolatile magnetic tunnel junction (MTJ), a spintronic device. The developed LSI technologies are (1) fast access and high density nonvolatile core memory embedded in logic LSIs, (2) nonvolatile ternary content addressable memory (TCAM), (3) error correction circuits for highly reliable logic LSIs, (4) three-dimensional chip stack for nonvolatile logic LSIs, and (5) a reliable three-terminal spintronics device. They will be presented at the 2012 IEEE VLSI Symposia held at Honolulu, Hawaii on June 12-15, 2012.
Other press releases about this article
- Tohoku University Develops World's First Fast Access Embedded Memory that Stores Data without using Power
- Tohoku University Develops the World's First 3-D Reconfigurable Spin Logic Chip with Spintronics Technology
- Groundbreaking New Technology for Improving the Reliability of Spintronics Logic Integrated Circuits - Progress towards the commercialization of circuits that enable electronic devices to consume zero standby power
- The World's Smallest Cell Implementation for a High-Density Standby-Power-Free TCAM in Combination with Silicon/Magnetic Devices
- First demonstration of highly reliable spintronics devices
[For inquiries]
Naoki Kasai, Deputy Director
Center for Spintronics Integrated Systems, Tohoku University
TEL: +81-22-217-6115
E-mail: n-kasai*csis.tohoku.ac.jp (Replace * with @)
