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Tohoku University and Tsinghua University have contributed funds to support research and exchange activities jointly conducted by researchers at both universities since 2019.

If you wish to apply for this third round of funding, submit an application form by February 22, 2023 after consultation with appropriate colleagues at Tsinghua University.

Online Application Period:

From Friday, December 16, 2022 to Wednesday, February 22, 2023

Research Areas:

Applications from all fields are welcome. Priority will be given to proposals from the following fields: Materials Science, Spintronics, and Disaster Science.

Funding Period:

From Saturday, April 1, 2023 to Monday, March 31, 2025
※However, due to both universities' financial years being different, the funding periods at each university will differ.

Application Guidelines
Application Form

Please submit all applications to the Tohoku University Global Engagement Division at the email address below.