Tohoku University Engineering Summer Program 2017

Tohoku University's Engineering Summer Program (TESP) is designed to inspire graduate level students in the field of engineering. The program provides a series of lectures and hands-on activities in robotics, electrical engineering and structural materials engineering.

All courses are taught in English.

The program also gives participants the opportunity to experience some of Japan's unique traditional culture.

Date: July 24 - August 4,2017
Location: Aobayama campus, Tohoku University
Application Deadline: April 28
Fee: JPY 15,000
For more on the program and application process:


Fang Han
TEL & Fax: +81-22-795-7996

Page Top