Tohoku University's School of Engineering is pleased to introduce TIE 2026, a new summer program focused on technology, innovation and entrepreneurship. It will run for four weeks from June 29, and applications are currently open.

The program aims to equip participants with the skills and mindset to develop technology-driven business plans that tackle real-world challenges, including those posed by an aging society and natural disasters.

Master's-level students worldwide with an interest in digital transformation and entrepreneurship are especially encouraged to apply.

Period: June 29 - July 24, 2026
Language: English
To apply: https://forms.gle/adbduihBuhkmg4ht9
Deadline: May 10, 2026
* Nomination from partner universities is optional. However, applicants are required to inform their academic supervisor and international office at their home institution upon application.

TIE 2026 Overview

In this program, students will:

• Identify real-world challenges in a digital society
• Develop solutions using digital tools or technologies and entrepreneurial approaches
• Build business models and prototypes
• Present their ideas in a final pitch

The program consists of lectures on digital technologies and entrepreneurship, group-based project work, Japanese language classes, as well as cultural experiences, field trips and social activities organized by Tohoku University students.

For more information, please see the attached flyer. (pdf)